IC Package Design Engineer (Senior/Staff/Senior Staff/Principal)

THE COMPANY Established in early 2024, at Analogue Insight we are bridging the Analogue and Digital Worlds for Tomorrow through our Chiplet Solutions. Our core expertise lies in developing cutting-edge Chiplet technology that serves as the building block for advanced communication systems. Our Chiplets are designed to offer high performance, scalability, and integration flexibility, enabling our clients to achieve breakthroughs in computation speed, data processing, and connectivity. For more information about us, check out our website ( Analogue Insight ) and LinkedIn Page ( Analogue Insight™: Overview | LinkedIn ). THE ROLE We are seeking a highly skilled and experienced IC Packaging Engineer to provide technical leadership and architectural ownership of advanced IC and System-in-package(SiP) in a fast-growing startup environment. This role is designed for a senior technologist who combines deep hands-on expertise with system-level thinking, and who thrives in high-ambiguity, high-impact settings. You will define and drive high-performance, low-power packaging architectures spanning 2D and RDL based fan-out (2.5D), chiplet-based designs, and heterogeneous integration, leading efforts from early technology path finding through production ramp. You will work closely with foundries, OSATs, substrate suppliers, and internal cross-functional teams to shape both product execution and long-term packaging strategy. Hiring Manager: Christian Borelli , Founder and CSO. KEY RESPONSIBILITIES Serve as technical authority for IC and SiP packaging across multiple products and programs. Own package architecture and technology roadmap, aligned with product, cost, and scalability goals. Lead chiplet-based packaging strategies, including UCIe, silicon interposers, 3D stacked die solutions, and advanced RDL. Perform and guide hands-on package design and physical layout, including critical structures for High-speed SerDes/PHY (PCIe, CXL), LPDDR5, UCIe, and Other multi-gigabit interfaces. Define substrate stack-ups, materials, bump/RDL architectures, and DFM guidelines for advanced nodes. Drive SI/PI, thermal, mechanical, and reliability trade-offs at the system and package levels. Lead external engagement with OSATs, foundries, and key suppliers for technology development and manufacturing readiness. Influence product roadmap, risk management, and investment decisions through technical insight. Establish scalable design methodologies, best practices, and reusable packaging flows. WHAT WE’RE LOOKING FOR Must-have Technical skills: BSEE or MSEE (PhD a plus) in Electrical Engineering, or related field. Minimum of 10+ years of experience with extensive IC packaging expertise for SoCs, ASICs, or memory products. Deep hands-on expertise in Flip-Chip BGA (FCBGA) and System-in-Package (SiP), RDL, silicon interposers, and chiplet architectures (UCIe) Strong understanding of electrical, mechanical, thermal, and reliability design trade-offs, Advanced packaging materials and substrate technologies, Design-for-Manufacturing (DFM) and yield optimization Demonstrated ability to operate autonomously, make high-impact decisions, and execute in a startup environment. Excellent analytical and problem-solving skills, with a keen eye for detail. Effective communication and teamwork skills, with the ability to collaborate with cross-functional teams. Demonstrated ability to mentor and guide less experienced engineers. Familiarity with industry standards, protocols, and compliance testing. Soft & Professional Skills : Clear, structured communication in professional English—able to explain complex results concisely Collaborative and feedback-oriented mindset Demonstrated ability to mentor and guide less experienced engineers Strong ownership, reliability, and follow-through Curious, self-motivated attitude, eager to learn and explore new tools or methods High level of integrity and professionalism in representing the company and handling sensitive information. Cadence Allegro Package Designer (APD) or equivalent EDA tools. Strong background in flip-chip BGA package design and layout. SI/PI expertise preferred, including S-parameter extraction and PDN optimization using HFSS, SIwave, or Ansys Designer. Experience building new packaging methodologies or platforms from scratch. OUR CULTURE We’re a fully remote team of around 25 people distributed across the UK, Armenia, Italy, the US, Estonia, India, and beyond. We believe great talent is everywhere! Our values are our north star: We Grow Together, We Win Together . Excellence Builds Relationships . Trust Is Our Currency . Results Matter, but People Create Them . Connected, even remotely: We invest intentionally in staying connected through regular all-hands, 1:1s, technical reviews, and informal coffee chats, so collaboration feels natural and human despite the distance. High ownership, real impact: Everyone contributes directly to customer-facing IP. Your work doesn’t disappear into layers of management – it ships. How we work: We move fast but thoughtfully, communicate openly, and balance autonomy with support. Technical decisions are debated openly and grounded in data, trade-offs, and first-principles thinking. WHY JOIN US Remote-first flexibility – work from anywhere, with flexible hours Equipment & setup – we’ll provide the tools you need to succeed High-impact projects – design real analog IP used in customer silicon Supportive team culture – a dedicated manager and a team of colleagues ready to help Competitive, transparent compensation – adjusted for your location and engagement model Learning & growth – AI–DLP sessions, technical deep dives, and peer-led knowledge sharing that build both technical depth and system-level perspective RECRUITMENT PROCESS Founder Call (30 min) – mutual introduction and interest alignment Technical Interview (60 min) – fundamentals, reasoning, and problem-solving Presentation (45 min) – short presentation on a topic of your choice, to assess clarity, structure, and confidence in presenting your work HR & Culture Call (45 min) – values, collaboration style, and ways of working Offer & Next Steps (30 min) – offer walkthrough, alignment on details, and next steps, discussed in a final call with the founder. If you don’t meet every requirement but feel excited about the role, apply anyway. We value curiosity, integrity, and potential as much as experience.